Int-Principal Packaging Engineer- High Speed ASICs

SemiconductorTALENT.com, a division of Intelligent Technology Solutions, is a North American leader in providing executive search services to the microelectronics and engineering sectorsPackaging Engineer - ASIC2 positions ( Intermediate - Sr. / Principle)Location - Longmont, CORelocation - YESResponsibilities:- Work closely with a variety of different worldwide design teams to integrate package design into a total solutionRequirements:- BS in EE or CE or better- Experience working with ASIC speeds of 10g, 12.5g, 15g- Experience with High Speed ASIC, SLC and HiTCE packaging (Flipchip, large pkg)- 5 + years experience in one or more of the following areas:IC package design (Package technology, assembly is a plus) (Preferred)PCB Design Engineer (motivated to learn package design)Signal integrity for high speed digital applicationsPower integrity and deliveryMicrowave theory and/or Electromagnetic transmission line theory- Experience and or Knowledge with the following tools: Cadence Layout tools (APD) (Preferred)? Windows and Linux? Microsoft office (open office)? SKILL and perl (SKILL Preferred)? 2-D simulators? Ansoft TPA/HFSS/SIWave? Agilent ADS? Flomerics-FlothermApply for this job nowSemiconductorTALENT.com confidentiality policy About SemiconductorTALENT.com SemiconductorTALENT.com, a division of Intelligent Technology Solutions, is a highly specialized and successful recruitment agency. We represent excellent, well-funded pre-IPO and leading public companies all across North America. Our clients are industry leaders who develop advanced technologies for semiconductor, video / graphics / imaging, wireless, and networking / communications markets.