Packaging Technical Lead

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The Package Engineering Technical Lead is responsible for defining a Ball Grid Array electronic package. The candidate should be experienced in transmission line theory and practice. He / She will define the chip padring, interconnect scheme (to substrate), and manage the package layout design process. He / She will work with the system design engineer to define a ballout necessary to implement a robust electrical package. Minimum Requirements:Prior experience in board / system design or package design is preferred. BSEE with at least 5+ years of relevant experience is required. Tool use includes Cadence APD and Valor. Perl programming language and EXCEL familiarity are helpful.EOE

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