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 [Samsung] Digital IC, Mixed Signal IC, RFIC, Power IC, PHY/DSP, Digital H/W, Layout, RF Testing

Details
Country: USA
Location: California-Silicon Valley/San Jose Atlanta, GA
Total applied: 30
Job Category:Engineering
Location:Atlanta, GA
Status:Full Time, Employee
Occupations:Electrical/Electronics Engineering;RF/Wireless Engineering;Systems/Process Engineering
Career Level:Experienced (Non-Manager)
[Samsung] Digital IC, Mixed Signal IC, RFIC, Power IC, PHY/DSP, Digital H/W, Layout, RF Testing

Digital IC Design Engineer

Job Description

Primary Responsibility: Working within a wireless IC product design team and provide various purpose digital solutions for wireless system-on-chip product development. Essential Function includes architectural definition, logic design, layout, implement, calibration, and testing verification of digital block functionalities. Candidate will support synthesis, digital place and route, timing verification, and production test method generation. As a member of a design team, candidate should actively communicate with other members leading the digital function part of IC systems.

Education and required experience

MS in Mixed signal IC design field in Electrical Engineering. Possesses a minimum of 5 years related experience in Digital IC block design for communications, experience of product release to market is a plus.

Required Skills

Must be familiar with RTL coding with verilog, logic systhesis, verification, timing analysis, verilog-D simulation, floor planning and place and route for chip integration, also must be able to create specification of digital functions, required tool experience covers Synopsys, DFT, ATPG, Cadence or other CAD tools and script such as Perl/TCL/AWK. FPGA Design experience is a must. Strong lab experience with understanding of emulators, debuggers, logic analyzer and oscilloscope is required. Candidates must be a team player with good communication and mentoring skills and positive attitude.

 

Mixed Signal IC Design Engineer

Job Description

The engineer in this position will be primarily responsible for design, development, and evaluation of analog, digital and mixed-signal circuitry in wireless communication IC’s. The person in this position will be involved in various wireless communications systems projects performing specification generation, block and system topology development, design and verification working heavily with system designers

Education and required experience

MS in Mixed signal IC design field in Electrical Engineering. possesses a minimum of 5 years related experience in mixed-signal IC design for communications, experience of product release to market is a plus.

Required Skills

Course work in Analog/Digital IC design and/or Communications systems is necessary, must have a solid knowledge in basic analog circuit design concepts such as noise, feedback, stability, switched capacitor, PLL, data conversion. High speed circuit design experience is a plus. Candidates must be able to follow design procedures from specification generation through final characterization and documentation. Good communication skill is required to work as a team member with various background, should be a team player with positive attitude and has mentoring skills, can make clear and concise presentations of designs in critical design review sessions. Must be familiar with contemporary CMOS process, CADENCE (Spectre, SpectreRF, Virtuoso), ADS, MATLAB simulator.

 

 

RFIC Senior Design Engineer

Job Description

The individual in this position will perform detailed circuit design for integrated RF amplifiers, mixers, filters, VCOs and power amplifiers for RFICs. Responsibilities will include: system level performance analysis and block level specification determination, functional level circuit architecture, design capture and simulation using an advanced CAD environment, transistor level circuit layout and direction of mask design resources, laboratory validation of circuits performance and system impact of functional block performance on the IC, selection of components and equipment based on analysis of specifications, and review of vendor capability to support development

Education and required experience

MS in RF IC design field in Electrical Engineering. possesses a minimum of 5 years related experience in RF IC design for wireless communications, experience of product release to market is a plus.

Required Skills

BSEE or equivalent required and graduate level degree strongly preferred. At least five to eight years of applicable or direct experience is required with a thorough knowledge of LNA, mixer, power amplifier, synthesizer, and RF filter design. Knowledge of CMOS RF is preferred.

 

 

Power Management IC Design Engineer

Job Description

The individual in this position will perform conceptual and detailed transistor level IC design of power management integrated circuits (PMIC’s). This individual will collaborate with product line engineers to architect/define/specify PMIC’s to work with power amplifiers and other radio products. The candidate will use circuit simulation tools (primarily Cadence) to design these commercial IC’s to meet the agreed-upon requirements. Additional duties include performing test and evaluation of prototype PMIC’s to determine if the IC meets performance requirements and simulation predictions.

Education and required experience

BSEE or equivalent is required, MSEE preferred. A minimum of five years of analog IC design experience is necessary.

Required Skills

Experience with switched mode power supplies (SMPS) is a must. Experience with LDO’s, bandgaps, power FET’s, logic design, D2A’s… is a big plus. Experience with radio circuits and systems, especially RF power amps, would be a plus. Communicating with the product line engineers is a must. This is done through presentations of your work, attending appropriate team meetings, and documenting your work.

 

 

Senior Layout Engineer

Job Description

The individual in this position will be responsible for full custom layout of cutting edge analog and mixed signal RF IC designs. Candidate will take ownership of multiple large sections of custom layout, and be responsible for all aspects of the physical design from interacting with the design engineer on schematic issues to custom layout. Must possess strong debug and problem solving skills for LVS, DRC and layout issues. Ideal candidate will have top-level experience as well as experience in 'taping out' chips to foundries.

Education and required experience

BSEE or equivalent is required. Must have 5 years hands on RF IC Layout experience.

Job Requirements :

Must know Cadence Virtuoso Layout Editor and Verification tools such as Calibre, Dracula and Hercules. Candidate is required to have knowledge of electrical issues such as EM, coupling and RC. Ideal candidate would also have the ability to script in the layout and verification tools to improve his/her productivity.

 

 

RF Testing Technician

Job Description

This position will be responsible for troubleshooting, debugging, and tuning RF integrated circuits. Candidate will also be responsible for setup and maintenance of test fixtures, collecting data and assisting the Design Engineer in getting the product ready for release to Operations.

Education and required experience

Requires an Associate degree in electronics, or equivalent combination of training and experience with a minimum of 3+ years of RF related experience.

Required Skills

Candidate should have experience working with power amplifiers as well as discrete transistors. Good working knowledge of RF spectrum analyzer, RF network analyzer, and network analyzer calibration techniques is required. Programming with Visual Basic would be a plus.

Experience performing mechanical assembly. Formal training in soldering and knowledge of ESD handling techniques is a plus. Ability to solder fine pitch devices using a microscope. Ability to assemble from fabrication and assembly drawings as well as from schematics or conceptual sketches. Experience in reading schematic and ECN instructions. Skill and experience in soldering and rework electronic assembly.

 

 

 

PHY/DSP: Senior Engineer

 

 

This position offer the opportunity to join development of digital communication signal processing algorithm and system architecture for low-power advanced wireless connectivity applications.

 

The candidate will work together with SoC designers involved in design, verification, and implementation of advanced signal processing algorithms for wireless connectivity solutions.

 

PhD preferred, MSEE required with in-depth experience in broadband wireless signal processing algorithm development and system implementation.

 

In-depth wireless modem design experience for WLAN/WPAN applications is required with good understanding of wireless networking standards (IEEE 802.11 / 802.15).

 

Expertise in OFDM and MIMO detection is required.

Expertise in one or more of the following design blocks is required: modem, equalizers, FEC, channel estimation, synchronization, digital filters, RF/analog impairment modeling, and calibration.

 

Define/compare system architecture, and contribute to the activities of algorithm development, modeling, coding, performance analysis, behavioral simulation, bit accurate simulation, lab test, debugging, and system integration.

 

Bit-accurate MATLAB and C/C++ system modeling and simulation experience preferred.

Knowledge of RTL coding or good understanding of H/W implementation constraints is preferred.

Test experience including functional and performance verification within FPGA development platform is plus.

Must be able to work with digital H/W designers as well as RF engineers in overall design and verification activities.

Understanding of RF/analog circuitry on overall system performance is helpful.

Prepare test and verification procedures and provide hands-on optimization and de-bugging in a prototype environment.

 

Must be able to manage own schedule, tasks and deliverables while working and coordinating closely with other team members.

Good communication skills and real time problem-solving abilities.



 

Digital H/W: Senior Engineer

 Job Description / Requirements

 This position offers opportunity to design and implement prototype digital hardware platform for low-power high data rate wireless connectivity applications. Ideal candidate will be an experienced logic design engineer for design, prototyping and integration of large complex digital wireless modem architecture.

 MSEE/PHD with 7+ years (BSEE with 12+ years) of experience in digital logic design and implementation. 7+ years of hands-on experience in FPGA and/or ASIC development is required.Solid digital design skills for ultra high speed and low-power architecture with wireless modem experience strongly desired.

 Experience in wireless standards such as IEEE 802.11 n/g/a/b, Bluetooth, and other WLAN/WPAN standards is highly recommended.Use design tools to run synthesis, place and route, static timing analysis, and other verifications.Excellent RTL coding (Verilog) skill is required.Prepare verification test plans and write test benches.Experience with implementation of AGC routines, OFDM/MIMO, Viterbi decoder, and other baseband algorithms is strongly preferred. Must be able to design, implement, program, and lab test/debug for high speed wireless modem prototypes in FPGA platforms including Xilinx, Altera, etc.Experienced in engineering software applications including: schematic capture, high-speed digital, analog, and mixed signal PCB layout.

 Work closely with system, RF, SW, and other engineers on implementation of HW/FW/SW blocks, interfaces, FPGA/ASIC prototyping, requirements verification, lab testing and specifications.Understanding effects of analog and digital circuitry on system performance and working with system and RF engineers to resolve issues if necessary. Proficiency in C or Matlab helpful. Must have ability to perform against aggressive deadlines and work closely with teams located in different parts of the world.Must have excellent interpersonal and teamwork skills, and proven ability to work effectively in a fast-paced environment.

- Apply for [Samsung] Digital IC, Mixed Signal IC, RFIC, Power IC, PHY/DSP, Digital H/W, Layout, RF Testing

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