Engineer, Senior Packaging

Marvell. Moving Forward Faster.Marvell offers revolutionary devices that touch every point of the communications infrastructure: switching, transceivers, wireless, PC connectivity, communications controllers, and storage. Our continuous cycle of innovations has enabled Marvell to consistently deliver the industry’s gold standard, emerging as the market leader in virtually all of our product categories.

Position Description:

Work with Product Marketing and Engineering to develop the most cost/performance effective package solutions. Manage projects from concept through development, qualification to production. Work with suppliers to leverage on their capabilities to provide design and assembly supports. Work with assembly suppliers to develop new packages and process improvements and problem solving.Support off-shore packaging developments.

To Apply Visit Marvell Semiconductor

Qualifications:

5 years IC packaging development experience in semiconductor industry especially on PBGA,TFBGA.Expert in package substrate design/layout/review using Cadence APD design tool. Good computer and AutoCAD skills. Knowledge of cost/performance trade-off analysis of various packages with respect to electrical/thermal performance. Experiences of substrate design for multi chip package with DRAM inside and high speed devices. Expert of assembly process and design rules. Knowledge of package substrate fabrication process. Good communication skills, project management and interpersonal skills. BS EE/ME with 5+ Years of relevant experience.