Packaging Engineer

PACKAGING ENGINEER

Orthodyne Electronics is the leading manufacturer of ultrasonic wire bonders, with an established tradition of developing revolutionary products for the semiconductor and microelectronics industries.

Orthodyne is an organization that hires exceptional individuals for the long term, invests in their growth and development, and offers them a warm environment of shared goals and values, rich experiences and opportunities. We look for individuals whose talents and accomplishments will contribute to our thriving organization.

Currently we have an opening for an experienced packaging engineer in our strategic development group. Within a group of engineers and scientists with different backgrounds and experiences, the successful candidate will take the lead in spearheading and assessing the feasibility of improved and advanced power interconnect and packaging designs and processes.

DUTIES & RESPONSIBILITIES:Will monitor, analyze and interpret technical and market trends, as well as IP in the areas of interest.Will creatively search for, conceptualize and develop improved and/or new interconnect and packaging processes, and will be instrumental in bringing them to customers and the market. Will be responsible for leading specific projects, contributing ‘hands-on’ work to those projects, as well as contributing to other projects assigned to the group.Will work cross functionally with other departments internally, and propose, initiate and lead efforts in cooperation with customers, research institutes (universities) as well as other equipment or material suppliers.Will develop and document world leading knowledge in the areas of interest, publish papers and develop IP as needed or appropriate.

EXPERIENCE REQUIRED: B.S. or M.S. in Material Science, Physics, Mechanical Engineering, Electrical Engineering, or a similar field. Ph.D. welcome. 5 years experience in semiconductor package or module development, ideally in design, characterization and manufacturing. Knowledge in and experience with different design steps (lead frame, module) and packaging processes (like die attach, wire bonding, flip chip, molding).Demonstrated success in bringing a design from development into manufacturing.Familiarity with CAD software, preferably ProE

SKILLS REQUIRED: Ability to generate creative and innovative solutions. Good analytical and problem solving, interpersonal, and communication skills. Ability to understand and apply knowledge to new and unique situations, able to work independently as well as within a team. This position is, at times, very hands on and the successful candidate will be comfortable in the office environment, the engineering lab environment, where prototypes are tested using various test equipment, but also in contact/cooperation with customers and/or other suppliers to the industry. Willingness to travel (10%).