Principal Packaging Engineer

Summary:

Candidate will be responsible for leading and directing the development of system-in- packaging strategies, characterization and development of materials, processes and reliability for the manufacturing of leading edge, high-density power converters in a fast-paced product development team environment.

 

Responsibilities:

· Leads cross-functional teams in developing system in package (SIP) modules and characterizing materials and processes that meet product performance, high volume manufacturing, high reliability, and cost requirements.

· Identifies, assesses and develops materials and processes including lead-free soldering, SMT technology, flip chip or micro-BGA interconnection, chip underfill and encapsulation, transfer molding.

· Works closely with design, manufacturing, and quality engineers on product packaging development, assembly process optimization, and reliability assessment.

· Plans and executes experiments to determine material interactions and impact of thermal, electrical, mechanical stresses on product performance, yield, and reliability.

· Participates in supplier selection processes and material qualifications to ensure product performance, reliability and cost targets are met.Determines failure mechanisms related to materials and processes utilizing analytical techniques and/or FEA modeling. Writes technical reports on research and development activities, process and materials specifications, and internal failure analysis reports.  Makes presentations to peers and management on progress. Provides guidance during technology transfer to manufacturing engineering, production, and licenses. Guides and mentors junior engineers to promote skills growth.

 

Critical Skills, Knowledge, and Abilities: Ability to assess the capability of a package design to meet stringent performance and reliability requirements by conducting DOE in conjunction with rigorous analysis. In-depth understanding of various failure mechanisms of devices and packages. These include solder fatigue, intermetallics formation, fracture mechanics, moisture absorption, corrosion, electro/chemical migration, and visco-plastic behavior. Demonstrated expertise in developing advanced packaging and processing strategies for system in a package devices incorporating high layer count laminate and ceramic substrates, ferrites, flip chips, BGA’s, plastic packages, lead-free soldering, MSL, transfer molding and encapsulation, high current interconnects Ability to use a variety of analytical techniques such as SEM/EDX, DSC, TMA, ASM, FTIR to characterize material properties and perform failure analysis.  Good understanding of metal, ceramics, and polymer material properties and their behaviors in relation to electronics package reliability. Knowledge of advanced thermal management materials and strategies  Demonstrated use of decision-making and problem-solving tools including structured problem solving, design of experiments, fault trees, failure mode and effect analysis, and statistical analysis techniques.  Ability to be an independent, creative thinker to solve cutting edge technical challenges within the constraints of an overall system design and cost model.   Excellent written and verbal communication skills together with demonstrated ability to successfully manage development projects.

 

Minimum Requirements:M.S. or Ph.D. in Materials Science, Metallurgical, Mechanical, or Electrical Engineering or related technical field. Minimum 8 years experience in microelectronics packaging and assembly for high density, high power devices or systems-in-package modules.