R&D Engineer III HEM

Honeywell International is a $36 billion diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; automotive products; turbochargers; and specialty materials. Based in Morris Township, N.J., Honeywell’s shares are traded on the New York, London and Chicago Stock Exchanges. For additional information, please visit www.honeywell.com The company is committed to providing quality products, integrated system solutions and services to customers around the world. Honeywell products touch the lives of most people everyday, whether you’re flying on a plane, driving a car, heating or cooling a home, furnishing an apartment, taking medication for an illness or playing a sport.R&D ENGINEER-HEM Honeywell Electronic Materials is a global leader in the supply of innovative materials to the semiconductor industry, providing solutions to our customers' manufacturing challenges. Honeywell's expertise in both chemistry and metallurgy and commitment to disciplined quality processes enable the development of superior, cutting-edge technologies that are now being introduced to the flat panel display (FPD), photovoltaic and printable electronics marketplaces. . We are looking for an R&D ENGINEER for our recently announced expanded Spokane Research and Development facility whose main focus will be on developing new products related to electronics packaging. SUMMARY:The incumbent will be responsible for the creation of profitable new products for the thermal and mechanical packaging of microelectronics. This includes the invention development, design, preparation, and testing of materials for interconnect, optoelectronics and other electronics packaging applications.  Working with external partners to leverage outside capability for new product creation, the job requires high quality, timely work and continuous improvement. Leading development projects on new products, new materials, and new processes for thermal management will be part of the challenges.  MAJOR AREAS OF RESPONSIBILITY:Support process and application development for interconnect packaging and thermal management solutions Work the development team, the commercial group, customers and OEM’s to identify, define and conduct development projects Use standard lab and specialized lab equipment (i.e. SEM, CSAM, etc). Work with process engineering, equipment, quality and production departments to transfer developmental technology into production Provide technical support for existing products Using statistical problem solving methods, participate in brain storming exercises and conduct designed experiments as needed Identify, design, conduct and evaluate experiments and experimental testing programs for various projects.  This also includes the ability to conduct a measurement system analysis Thoroughly characterize new products and processes so that they transfer seamlessly and cost effectively into production with high yields Develop robust manufacturing processes that complement or expand HEM’s core competencies in collaboration with other team members Provide regular updates on project status through accepted communication modes.  Examples include the VPD system, e-mail, meetings & presentations Follow six sigma methodologies in day to day activities including statistical problem solving methods, designed experiments, measurement system analysis, product scorecard and any other black belt tools that apply to the problem at hand Keep current on technology developments, trends, innovations and issues related to electronic materials, micro electronic packaging, and materials processing technologies Generate patents and write technical papers as appropriate Prepare electronic packaging materials for shipment.  Properly follow documentation, order entry, labeling, packing and shipping procedure and processes Follow all standard operating procedures, including safety and laboratory to insure consistent quality and timely delivery of results.BASIC QUALIFICATIONSB. S. Metallurgy, Material Science, Physics or similar scientific or engineering discipline Minimum 7 years experience in electronics Packaging or related technologies (soldering, powdered metal/poly matrices)  (Appropriate advanced degrees will be considered WITH practical experience) Fundamental understanding of metallurgy, material science, mechanics, and heat transfer such as soldering, brazing, interfacial reactions, thermo-mechanical processing, casting, phase diagrams, and diffusionFundamental understanding of electronic packaging including qualification testing (thermal and mechanical) “Plus” QualificationsM.S. or Ph.D. in Metallurgy, Material Science, or Physics Polymer/metal systems experience Thermal Management applications skills Experience working in a matrixed organization as both a team leader and team member.