Semiconductor Packaging Engineer , Manufacturing Process

Industry leading developer and manufacturer of cutting edge alternative energy equipment and instrumentation has immediate need for experienced Manufacturing Process Engineer experienced in Semiconductor Packaging Processes.  Will apply thorough knowledge and understanding of all details of the process such as chip dimensions, metallization, etc. in solving technical problems.  Executes product development efforts, experiments, and process runs.  Able to understand device characterization issues and develop device testing plans.  Performs detailed analyses of solar cells through various inspections and tests, prepares summary reports as appropriate.  Uses experience and intuition to recommend innovations to improve product analysis, evaluation, and other processes.  Works with engineering management to develop and initiate standards and methods for assembly, inspection, and testing.

 

Requires Bachelor's degree (BSEE, BSET, BS in Applied Science, or equivalent) from a four-year college or university and a minimum of 5 years hands-on related experience with semiconductors.  Possesses an understanding of various semiconductor package process technologies including die attach, wire bonding, metallization, encapsulation, plating, wafer probing, wafer sawing and die handling.  Proficiency in, Microsoft Word and Excel. Solidworks may be useful.  Ability to operate laboratory equipment including, X-Ray fluorescence analyzers (XRF), oscilloscopes, multimeters, microscopes.