Packaging Engineer

AuthenTec, Inc., with headquarters in Melbourne, Florida, is the world leader in fingerprint sensory security, innovation and sales to the PC, wireless, and access control markets.

 

The packaging engineer will be responsible for sustaining high volume production of state-of-the-art BGA packages for advanced fingerprint sensors at our packaging subcontractors.  In addition, the packaging engineer will work with our engineering and marketing teams to develop cost effective, robust and aesthetically pleasing packages for new fingerprint sensor ICs.  He/she will also provide direct technical support to our customers worldwide.  Domestic and international travel will be required.

 

Required Education/Experience:

 BS and/or MS in Mechanical Engineering or other engineering discipline or physical science Five to ten years experience in a high volume semiconductor manufacturing environment with strong experience in transfer molding of IC packagesStrong working knowledge of substrate design and fabricationExperience in material selection, thermal and electrical properties of IC packagesExperience with semiconductor packaging processes including adhesive attach and wirebondingWorking knowledge of DOE/SPC and semiconductor package qual testing

AuthenTec is an Equal Opportunity Employer